Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebonding

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Tay, A.A.O., Ng, B.H., Ong, S.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73379
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Institution: National University of Singapore

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