Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafers

Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafers

Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)

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Bibliographic Details
Main Authors: Li, X.P., Chan, C.C., Liu, K., Rahman, M., Liu, X.D.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73387
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/73387

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