Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafers

• Main Authors: Li, X.P., Chan, C.C., Liu, K., Rahman, M., Liu, X.D.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73387
• Institution: National University of Singapore

Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)