Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages
10.1109/ECTC.2009.5074195
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2014
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sg-nus-scholar.10635-734002015-05-18T20:14:27Z Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages Ho, S.L. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ECTC.2009.5074195 Proceedings - Electronic Components and Technology Conference 1397-1403 PECCA 2014-06-19T05:34:39Z 2014-06-19T05:34:39Z 2009 Conference Paper Ho, S.L.,Tay, A.A.O. (2009). Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages. Proceedings - Electronic Components and Technology Conference : 1397-1403. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2009.5074195" target="_blank">https://doi.org/10.1109/ECTC.2009.5074195</a> 9781424444762 05695503 http://scholarbank.nus.edu.sg/handle/10635/73400 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/ECTC.2009.5074195 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Ho, S.L. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Ho, S.L. Tay, A.A.O. |
| spellingShingle |
Ho, S.L. Tay, A.A.O. Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages |
| author_sort |
Ho, S.L. |
| title |
Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages |
| title_short |
Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages |
| title_full |
Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages |
| title_fullStr |
Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages |
| title_full_unstemmed |
Effect of Shapes of Crack Fronts on the Mechanics of 3D Interfacial Delamination in IC Packages |
| title_sort |
effect of shapes of crack fronts on the mechanics of 3d interfacial delamination in ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73400 |
| _version_ |
1681087741317611520 |