Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact

Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Jie, G., Lim, C.T., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73437
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Institution: National University of Singapore
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Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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