Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors:	Jie, G., Lim, C.T., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73437
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73437
record_format	dspace
spelling	sg-nus-scholar.10635-734372015-05-24T00:28:02Z Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact Jie, G. Lim, C.T. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 547-552 2014-06-19T05:35:06Z 2014-06-19T05:35:06Z 2004 Conference Paper Jie, G.,Lim, C.T.,Tay, A.A.O. (2004). Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 547-552. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73437 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Jie, G. Lim, C.T. Tay, A.A.O.
format	Conference or Workshop Item
author	Jie, G. Lim, C.T. Tay, A.A.O.
spellingShingle	Jie, G. Lim, C.T. Tay, A.A.O. Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
author_sort	Jie, G.
title	Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
title_short	Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
title_full	Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
title_fullStr	Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
title_full_unstemmed	Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
title_sort	equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73437
_version_	1681087748058906624

Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact

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