Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Jie, G., Lim, C.T., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73437
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Institution: National University of Singapore

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