Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
Saved in:
Main Authors: | Jie, G., Lim, C.T., Tay, A.A.O. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73437 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Simulation of mechanical response of solder joints under drop impact using equivalent layer models
by: Gu, J., et al.
Published: (2014) -
Modeling of solder joint failure due to PCB bending during drop impact
by: Jie, G., et al.
Published: (2014) -
A hybrid equivalent-layer model for analysis of solder joint reliability of ultra-fine pitch packages
by: Zhao, B., et al.
Published: (2014) -
Investigation into Solder Joint Failure in Portable Electronics Subjected to Drop Impact
by: SEAH KAH WOON, SIMON
Published: (2012) -
Drop impact: Fundamentals & impact characterisation of solder joints
by: Wong, E.H., et al.
Published: (2014)