Interaction of multiple delaminations and die in a plastic IC package
10.1109/IEMT.2010.5746675
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2014
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sg-nus-scholar.10635-735452015-02-15T08:13:58Z Interaction of multiple delaminations and die in a plastic IC package Ho, S.L. Yu, J. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/IEMT.2010.5746675 Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium - 2014-06-19T05:36:24Z 2014-06-19T05:36:24Z 2010 Conference Paper Ho, S.L.,Yu, J.,Tay, A.A.O. (2010). Interaction of multiple delaminations and die in a plastic IC package. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IEMT.2010.5746675" target="_blank">https://doi.org/10.1109/IEMT.2010.5746675</a> 9781424488278 10898190 http://scholarbank.nus.edu.sg/handle/10635/73545 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/IEMT.2010.5746675 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Ho, S.L. Yu, J. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Ho, S.L. Yu, J. Tay, A.A.O. |
| spellingShingle |
Ho, S.L. Yu, J. Tay, A.A.O. Interaction of multiple delaminations and die in a plastic IC package |
| author_sort |
Ho, S.L. |
| title |
Interaction of multiple delaminations and die in a plastic IC package |
| title_short |
Interaction of multiple delaminations and die in a plastic IC package |
| title_full |
Interaction of multiple delaminations and die in a plastic IC package |
| title_fullStr |
Interaction of multiple delaminations and die in a plastic IC package |
| title_full_unstemmed |
Interaction of multiple delaminations and die in a plastic IC package |
| title_sort |
interaction of multiple delaminations and die in a plastic ic package |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73545 |
| _version_ |
1681087767805689856 |