Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects

Materials Research Society Symposium Proceedings

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Main Authors:	Balakumar, S., Haque, T., Kumar, R., Kumar, A.S., Rahman, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73561
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73561
record_format	dspace
spelling	sg-nus-scholar.10635-735612015-03-23T20:08:51Z Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects Balakumar, S. Haque, T. Kumar, R. Kumar, A.S. Rahman, M. MECHANICAL ENGINEERING Materials Research Society Symposium Proceedings 867 21-33 MRSPD 2014-06-19T05:36:35Z 2014-06-19T05:36:35Z 2005 Conference Paper Balakumar, S.,Haque, T.,Kumar, R.,Kumar, A.S.,Rahman, M. (2005). Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects. Materials Research Society Symposium Proceedings 867 : 21-33. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/73561 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Materials Research Society Symposium Proceedings
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Balakumar, S. Haque, T. Kumar, R. Kumar, A.S. Rahman, M.
format	Conference or Workshop Item
author	Balakumar, S. Haque, T. Kumar, R. Kumar, A.S. Rahman, M.
spellingShingle	Balakumar, S. Haque, T. Kumar, R. Kumar, A.S. Rahman, M. Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
author_sort	Balakumar, S.
title	Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
title_short	Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
title_full	Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
title_fullStr	Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
title_full_unstemmed	Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
title_sort	investigation on abrasive free copper chemical mechanical planarization for cu/low k and cu/ultra low k interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73561
_version_	1681087770742751232

Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects

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