Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects

• Main Authors: Balakumar, S., Haque, T., Kumar, R., Kumar, A.S., Rahman, M.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73561
• Institution: National University of Singapore

Materials Research Society Symposium Proceedings