Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools

10.1116/1.3071855

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Bibliographic Details
Main Authors: Liu, K., Zuo, D., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73669
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-736692023-10-29T22:59:49Z Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools Liu, K. Zuo, D. Li, X.P. Rahman, M. MECHANICAL ENGINEERING 10.1116/1.3071855 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 3 1361-1366 JVTBD 2014-06-19T05:37:56Z 2014-06-19T05:37:56Z 2009 Conference Paper Liu, K., Zuo, D., Li, X.P., Rahman, M. (2009). Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1361-1366. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3071855 10711023 http://scholarbank.nus.edu.sg/handle/10635/73669 000266500300068 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1116/1.3071855
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Liu, K.
Zuo, D.
Li, X.P.
Rahman, M.
format Conference or Workshop Item
author Liu, K.
Zuo, D.
Li, X.P.
Rahman, M.
spellingShingle Liu, K.
Zuo, D.
Li, X.P.
Rahman, M.
Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
author_sort Liu, K.
title Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
title_short Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
title_full Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
title_fullStr Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
title_full_unstemmed Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
title_sort nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73669
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