Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
10.1116/1.3071855
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sg-nus-scholar.10635-736692023-10-29T22:59:49Z Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools Liu, K. Zuo, D. Li, X.P. Rahman, M. MECHANICAL ENGINEERING 10.1116/1.3071855 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 3 1361-1366 JVTBD 2014-06-19T05:37:56Z 2014-06-19T05:37:56Z 2009 Conference Paper Liu, K., Zuo, D., Li, X.P., Rahman, M. (2009). Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1361-1366. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3071855 10711023 http://scholarbank.nus.edu.sg/handle/10635/73669 000266500300068 Scopus |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Liu, K. Zuo, D. Li, X.P. Rahman, M. |
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Liu, K. Zuo, D. Li, X.P. Rahman, M. |
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Liu, K. Zuo, D. Li, X.P. Rahman, M. Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
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Liu, K. |
title |
Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
title_short |
Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
title_full |
Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
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Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
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Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
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nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73669 |
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