Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools

10.1116/1.3071855

Saved in:
Bibliographic Details
Main Authors: Liu, K., Zuo, D., Li, X.P., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73669
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items