Nano-particle reinforced solders for fine pitch applications

Nano-particle reinforced solders for fine pitch applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Mohankumar, K., Tay, A.A.O., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73670
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Institution: National University of Singapore
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Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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