Nano-particle reinforced solders for fine pitch applications
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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2014
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sg-nus-scholar.10635-736702015-01-13T01:04:04Z Nano-particle reinforced solders for fine pitch applications Mohankumar, K. Tay, A.A.O. Kripesh, V. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 455-461 2014-06-19T05:37:56Z 2014-06-19T05:37:56Z 2004 Conference Paper Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Nano-particle reinforced solders for fine pitch applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 455-461. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73670 NOT_IN_WOS Scopus |
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Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Mohankumar, K. Tay, A.A.O. Kripesh, V. |
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Conference or Workshop Item |
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Mohankumar, K. Tay, A.A.O. Kripesh, V. |
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Mohankumar, K. Tay, A.A.O. Kripesh, V. Nano-particle reinforced solders for fine pitch applications |
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Mohankumar, K. |
title |
Nano-particle reinforced solders for fine pitch applications |
title_short |
Nano-particle reinforced solders for fine pitch applications |
title_full |
Nano-particle reinforced solders for fine pitch applications |
title_fullStr |
Nano-particle reinforced solders for fine pitch applications |
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Nano-particle reinforced solders for fine pitch applications |
title_sort |
nano-particle reinforced solders for fine pitch applications |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73670 |
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