Novel numerical and experimental analysis of dynamic responses under board level drop test

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Saved in:
Bibliographic Details
Main Authors: Tee, T.Y., Luan, J.-E., Pek, E., Lim, C.T., Zhong, Z.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73689
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Be the first to leave a comment!
You must be logged in first