Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design

Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design

10.1109/ITHERM.2006.1645434

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Bibliographic Details
Main Authors: Tay, A.A.O., Wei, S.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73730
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Institution: National University of Singapore
Description
Summary:10.1109/ITHERM.2006.1645434

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