Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design

10.1109/ITHERM.2006.1645434

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Main Authors:	Tay, A.A.O., Wei, S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73730
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-737302015-01-07T10:13:59Z Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design Tay, A.A.O. Wei, S. MECHANICAL ENGINEERING 10.1109/ITHERM.2006.1645434 Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2006 842-847 PITEF 2014-06-19T05:38:41Z 2014-06-19T05:38:41Z 2006 Conference Paper Tay, A.A.O.,Wei, S. (2006). Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2006 : 842-847. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ITHERM.2006.1645434" target="_blank">https://doi.org/10.1109/ITHERM.2006.1645434</a> 0780395247 http://scholarbank.nus.edu.sg/handle/10635/73730 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/ITHERM.2006.1645434
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, A.A.O. Wei, S.
format	Conference or Workshop Item
author	Tay, A.A.O. Wei, S.
spellingShingle	Tay, A.A.O. Wei, S. Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
author_sort	Tay, A.A.O.
title	Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
title_short	Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
title_full	Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
title_fullStr	Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
title_full_unstemmed	Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
title_sort	optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73730
_version_	1681087801002557440

Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design

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