Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Saved in:
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73859 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-73859 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-738592015-01-09T07:08:50Z Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects Wei, S. Tay, A.A.O. Vedantam, S. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 444-450 2014-06-19T05:40:13Z 2014-06-19T05:40:13Z 2005 Conference Paper Wei, S.,Tay, A.A.O.,Vedantam, S. (2005). Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 : 444-450. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/73859 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Wei, S. Tay, A.A.O. Vedantam, S. |
| format |
Conference or Workshop Item |
| author |
Wei, S. Tay, A.A.O. Vedantam, S. |
| spellingShingle |
Wei, S. Tay, A.A.O. Vedantam, S. Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| author_sort |
Wei, S. |
| title |
Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| title_short |
Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| title_full |
Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| title_fullStr |
Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| title_full_unstemmed |
Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| title_sort |
simulation-based design optimization of solder joint reliability of wafer level copper column interconnects |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73859 |
| _version_ |
1681087824365879296 |