Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects

Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Wei, S., Tay, A.A.O., Vedantam, S.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73859
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Institution: National University of Singapore
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