Study of PCB strains and component position under board level drop test
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
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2014
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sg-nus-scholar.10635-738832015-03-06T07:52:42Z Study of PCB strains and component position under board level drop test Ng, F.K. Lim, C.T. Pek, E. Luan, J.-E. Tee, T.Y. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 248-254 2014-06-19T05:40:30Z 2014-06-19T05:40:30Z 2005 Conference Paper Ng, F.K.,Lim, C.T.,Pek, E.,Luan, J.-E.,Tee, T.Y. (2005). Study of PCB strains and component position under board level drop test. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 248-254. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/73883 NOT_IN_WOS Scopus |
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Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Ng, F.K. Lim, C.T. Pek, E. Luan, J.-E. Tee, T.Y. |
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Conference or Workshop Item |
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Ng, F.K. Lim, C.T. Pek, E. Luan, J.-E. Tee, T.Y. |
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Ng, F.K. Lim, C.T. Pek, E. Luan, J.-E. Tee, T.Y. Study of PCB strains and component position under board level drop test |
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Ng, F.K. |
title |
Study of PCB strains and component position under board level drop test |
title_short |
Study of PCB strains and component position under board level drop test |
title_full |
Study of PCB strains and component position under board level drop test |
title_fullStr |
Study of PCB strains and component position under board level drop test |
title_full_unstemmed |
Study of PCB strains and component position under board level drop test |
title_sort |
study of pcb strains and component position under board level drop test |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73883 |
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