The role of simulation in failure prediction and design optimization in electronics packaging

10.1109/ESIME.2006.1644060

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Bibliographic Details
Main Author: Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73947
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Institution: National University of Singapore
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