The role of simulation in failure prediction and design optimization in electronics packaging
10.1109/ESIME.2006.1644060
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Main Author: | Tay, A.A.O. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73947 |
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Institution: | National University of Singapore |
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