Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow
Proceedings - Electronic Components and Technology Conference
Saved in:
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/75044 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-75044 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-750442015-02-02T08:24:26Z Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow Tay, A.A.O. Lin, T.Y. MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 371-378 PECCA 2014-06-19T09:10:16Z 2014-06-19T09:10:16Z 1998 Conference Paper Tay, A.A.O.,Lin, T.Y. (1998). Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow. Proceedings - Electronic Components and Technology Conference : 371-378. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/75044 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings - Electronic Components and Technology Conference |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Lin, T.Y. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. Lin, T.Y. |
| spellingShingle |
Tay, A.A.O. Lin, T.Y. Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow |
| author_sort |
Tay, A.A.O. |
| title |
Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow |
| title_short |
Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow |
| title_full |
Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow |
| title_fullStr |
Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow |
| title_full_unstemmed |
Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow |
| title_sort |
moisture-induced interfacial delamination growth in plastic ic packages during solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/75044 |
| _version_ |
1681088033018871808 |