Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Tay, A.A.O., Lin, T.Y.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/75044
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Institution: National University of Singapore

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