Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages

Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages

10.1109/EPTC.2006.342690

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Bibliographic Details
Main Authors: Hu, G., Tay, A.A.O., Zhang, Y., Zhu, W., Chew, S.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/75217
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Institution: National University of Singapore
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Summary:10.1109/EPTC.2006.342690

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