Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages
10.1109/EPTC.2006.342690
Saved in:
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/75217 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-75217 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-752172015-01-29T19:30:08Z Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages Hu, G. Tay, A.A.O. Zhang, Y. Zhu, W. Chew, S. MATERIALS SCIENCE AND ENGINEERING 10.1109/EPTC.2006.342690 Proceedings of the Electronic Packaging Technology Conference, EPTC 53-59 2014-06-19T09:33:49Z 2014-06-19T09:33:49Z 2006 Conference Paper Hu, G.,Tay, A.A.O.,Zhang, Y.,Zhu, W.,Chew, S. (2006). Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 53-59. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342690" target="_blank">https://doi.org/10.1109/EPTC.2006.342690</a> 142440665X http://scholarbank.nus.edu.sg/handle/10635/75217 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2006.342690 |
| author2 |
MATERIALS SCIENCE AND ENGINEERING |
| author_facet |
MATERIALS SCIENCE AND ENGINEERING Hu, G. Tay, A.A.O. Zhang, Y. Zhu, W. Chew, S. |
| format |
Conference or Workshop Item |
| author |
Hu, G. Tay, A.A.O. Zhang, Y. Zhu, W. Chew, S. |
| spellingShingle |
Hu, G. Tay, A.A.O. Zhang, Y. Zhu, W. Chew, S. Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages |
| author_sort |
Hu, G. |
| title |
Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages |
| title_short |
Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages |
| title_full |
Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages |
| title_fullStr |
Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages |
| title_full_unstemmed |
Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages |
| title_sort |
characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/75217 |
| _version_ |
1681088064400654336 |