Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages

• Main Authors: Hu, G., Tay, A.A.O., Zhang, Y., Zhu, W., Chew, S.
• Other Authors: MATERIALS SCIENCE AND ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/75217
• Institution: National University of Singapore

10.1109/EPTC.2006.342690