Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package

Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package

10.1109/ECTC.2007.373929

Saved in:
Bibliographic Details
Main Authors: Hu, G., Tay, A.A.O., Zhang, Y., Chew, S.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/75225
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:10.1109/ECTC.2007.373929

Similar Items