Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package
10.1109/ECTC.2007.373929
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2014
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sg-nus-scholar.10635-752252015-01-25T21:02:00Z Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package Hu, G. Tay, A.A.O. Zhang, Y. Chew, S. MATERIALS SCIENCE AND ENGINEERING 10.1109/ECTC.2007.373929 Proceedings - Electronic Components and Technology Conference 1062-1068 PECCA 2014-06-19T09:33:54Z 2014-06-19T09:33:54Z 2007 Conference Paper Hu, G.,Tay, A.A.O.,Zhang, Y.,Chew, S. (2007). Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package. Proceedings - Electronic Components and Technology Conference : 1062-1068. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2007.373929" target="_blank">https://doi.org/10.1109/ECTC.2007.373929</a> 1424409853 05695503 http://scholarbank.nus.edu.sg/handle/10635/75225 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
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ScholarBank@NUS |
| description |
10.1109/ECTC.2007.373929 |
| author2 |
MATERIALS SCIENCE AND ENGINEERING |
| author_facet |
MATERIALS SCIENCE AND ENGINEERING Hu, G. Tay, A.A.O. Zhang, Y. Chew, S. |
| format |
Conference or Workshop Item |
| author |
Hu, G. Tay, A.A.O. Zhang, Y. Chew, S. |
| spellingShingle |
Hu, G. Tay, A.A.O. Zhang, Y. Chew, S. Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package |
| author_sort |
Hu, G. |
| title |
Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package |
| title_short |
Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package |
| title_full |
Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package |
| title_fullStr |
Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package |
| title_full_unstemmed |
Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package |
| title_sort |
experimental and numerical study of the effect of viscoelasticity on delamination in a plastic ic package |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/75225 |
| _version_ |
1681088065823571968 |