Novel electrical performance analysis for leaded packages
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
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sg-nus-scholar.10635-816152015-01-30T17:28:53Z Novel electrical performance analysis for leaded packages Jin, Z. Ma, J. Iyer, M.K. Ooi, B.L. Leong, M.S. INSTITUTE OF MICROELECTRONICS ELECTRICAL ENGINEERING IEEE Topical Meeting on Electrical Performance of Electronic Packaging 101-104 174 2014-10-07T03:10:12Z 2014-10-07T03:10:12Z 1998 Conference Paper Jin, Z.,Ma, J.,Iyer, M.K.,Ooi, B.L.,Leong, M.S. (1998). Novel electrical performance analysis for leaded packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 101-104. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/81615 NOT_IN_WOS Scopus |
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IEEE Topical Meeting on Electrical Performance of Electronic Packaging |
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INSTITUTE OF MICROELECTRONICS Jin, Z. Ma, J. Iyer, M.K. Ooi, B.L. Leong, M.S. |
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Jin, Z. Ma, J. Iyer, M.K. Ooi, B.L. Leong, M.S. |
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Jin, Z. Ma, J. Iyer, M.K. Ooi, B.L. Leong, M.S. Novel electrical performance analysis for leaded packages |
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Jin, Z. |
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Novel electrical performance analysis for leaded packages |
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Novel electrical performance analysis for leaded packages |
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Novel electrical performance analysis for leaded packages |
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Novel electrical performance analysis for leaded packages |
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Novel electrical performance analysis for leaded packages |
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novel electrical performance analysis for leaded packages |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/81615 |
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