Novel electrical performance analysis for leaded packages

• Main Authors: Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
• Other Authors: INSTITUTE OF MICROELECTRONICS
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/81615
• Institution: National University of Singapore

IEEE Topical Meeting on Electrical Performance of Electronic Packaging