Novel electrical performance analysis for leaded packages

Novel electrical performance analysis for leaded packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Saved in:

Bibliographic Details
Main Authors:	Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/81615
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

Similar Items

Novel electrical performance analysis for leaded packages
by: Jin, Z., et al.
Published: (2014)

Novel method for Simultaneous Switching Noise analysis in electronic packages
by: Jin, Zhang, et al.
Published: (2014)

Novel method for Simultaneous Switching Noise analysis in electronic packages
by: Jin, Zhang, et al.
Published: (2014)

Circuit model of elastomer probe for fine pitch wafer level package test applications
by: Jayabalan, J., et al.
Published: (2014)

A novel test strategy for fine pitch wafer-level packaged devices
by: Jayabalan, J., et al.
Published: (2014)

A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
by: Ooi, B.L., et al.
Published: (2014)

Novel circuit model for three-dimensional geometries with multilayer dielectrics
by: Jayabalan, J., et al.
Published: (2014)

Electrical characterization of IC packages
by: Guruprasad B. G.
Published: (2008)

Via design optimization for high speed device packaging
by: Low, Hong-Guan, et al.
Published: (2014)

Via design optimization for high speed device packaging
by: Low, Hong-Guan, et al.
Published: (2014)

Compact CPW-to microstrip transition design for MMIC packaging
by: Fan, Y., et al.
Published: (2014)

A 2D time domain method for electrical analysis of electronic packages
by: Liu, E.-X., et al.
Published: (2014)

PEEC model for multiconductor systems including dielectric mesh
by: Jayabalan, J., et al.
Published: (2014)

Design-for-reliability methodology for evaluation of lead-free solder performance in electronic packaging assemblies
by: Pang, John Hock Lye
Published: (2008)

A novel equivalent circuit for E-shaped slot patch antenna
by: Ooi, B.L., et al.
Published: (2014)

Novel design of broadband volcano-smoke antenna
by: Tham, J.-Y., et al.
Published: (2014)

Design and development of interconnects for ultra-fine pitch wafer level packages
by: Tay, A.A.O., et al.
Published: (2014)

Springback study on leads of quad flat package
by: Rita Gozali.
Published: (2009)

Test bench modeling and characterization for fine pitch wafer level packaged devices
by: Jayabalan, J., et al.
Published: (2014)

A novel hybrid tdfem-pstd method with stability consideration
by: Fan, Y.J., et al.
Published: (2014)

IC packaging lead frame for reducing chip stress and deformation
by: LIM, THIAM BENG, et al.
Published: (2012)

A methodology for accurate modeling of a pad structure from S-parameter measurements
by: Jayabalan, J., et al.
Published: (2014)

Development of Lead-Free Nanocomposite Solders for Electronic Packaging
by: PAYMAN BABAGHORBANI
Published: (2010)

Efficient magnetic current model for analysis of LTCC electrically small antennas at Ka band
by: Zhang, M., et al.
Published: (2014)

Experimental investigation of novel multifingered antenna
by: Ooi, B.L., et al.
Published: (2014)

Modelling and application of elastomer mesh for microwave probing
by: Jayabalan, J., et al.
Published: (2014)

Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging
by: Tan, V.B.C., et al.
Published: (2016)

A novel LTCC power combiner
by: Ooi, B.L., et al.
Published: (2014)

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package
by: Tay, A.A.O., et al.
Published: (2014)

Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package
by: Tay, A.A.O., et al.
Published: (2014)

Spectral domain analysis of a microstrip Y-junction
by: Ooi, B.L., et al.
Published: (2014)

Spectral domain analysis of a microstrip Y-junction
by: Ooi, B.L., et al.
Published: (2014)

A novel coupled fed small antenna
by: Lee, C.L., et al.
Published: (2014)

Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging
by: Liao, E.B., et al.
Published: (2014)

Novel packaging material for mango transportation
by: Wongsuriyasak,S., et al.
Published: (2015)

Integrated hybrid dielectric resonator antenna for system-in-package application
by: Gao, Y., et al.
Published: (2014)

Thermal stress and fatigue analysis of microelectronic packaging
by: Tan, Meng Leong.
Published: (2011)

Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
by: Liao, E.B., et al.
Published: (2014)

Novel electromagnetic bandgap-fed tri-band coplanar slot antenna
by: Ooi, B.L.
Published: (2014)

A novel drain current I-V model for MESFET
by: Ooi, B.-L., et al.
Published: (2014)