Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors

10.1109/TMAG.2007.893118

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Bibliographic Details
Main Authors: Jiang, J., Bae, S., Kim, S.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83677
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Institution: National University of Singapore