Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors
10.1109/TMAG.2007.893118
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2014
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sg-nus-scholar.10635-836772023-10-26T09:27:42Z Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors Jiang, J. Bae, S. Kim, S. ELECTRICAL & COMPUTER ENGINEERING Cu spacer microstructure Electromigration FM/Cu spacer interface FM/Cu/FM tri-layers Interdiffusion of Cu spacer 10.1109/TMAG.2007.893118 IEEE Transactions on Magnetics 43 6 2836-2838 IEMGA 2014-10-07T04:43:55Z 2014-10-07T04:43:55Z 2007-06 Conference Paper Jiang, J., Bae, S., Kim, S. (2007-06). Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors. IEEE Transactions on Magnetics 43 (6) : 2836-2838. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893118 00189464 http://scholarbank.nus.edu.sg/handle/10635/83677 000246706200248 Scopus |
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National University of Singapore |
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Asia |
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Singapore Singapore |
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| topic |
Cu spacer microstructure Electromigration FM/Cu spacer interface FM/Cu/FM tri-layers Interdiffusion of Cu spacer |
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Cu spacer microstructure Electromigration FM/Cu spacer interface FM/Cu/FM tri-layers Interdiffusion of Cu spacer Jiang, J. Bae, S. Kim, S. Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors |
| description |
10.1109/TMAG.2007.893118 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Jiang, J. Bae, S. Kim, S. |
| format |
Conference or Workshop Item |
| author |
Jiang, J. Bae, S. Kim, S. |
| author_sort |
Jiang, J. |
| title |
Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors |
| title_short |
Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors |
| title_full |
Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors |
| title_fullStr |
Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors |
| title_full_unstemmed |
Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors |
| title_sort |
effects of cu interdiffusion on the electromigration failure of fm/cu/fm tri-layers for spin valve read sensors |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/83677 |
| _version_ |
1781784380722642944 |