Effects of Cu interdiffusion on the electromigration failure of FM/Cu/FM tri-layers for spin valve read sensors
10.1109/TMAG.2007.893118
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Main Authors: | Jiang, J., Bae, S., Kim, S. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83677 |
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Institution: | National University of Singapore |
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