Impact of TSV induced thermo-mechanical stress on semiconductor device performance

10.1109/EDAPS.2012.6469420

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Bibliographic Details
Main Authors: Lee, H.M., Liu, E.-X., Samudra, G.S., Li, E.-P.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83820
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Institution: National University of Singapore
Description
Summary:10.1109/EDAPS.2012.6469420