Impact of TSV induced thermo-mechanical stress on semiconductor device performance

10.1109/EDAPS.2012.6469420

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Bibliographic Details
Main Authors: Lee, H.M., Liu, E.-X., Samudra, G.S., Li, E.-P.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83820
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-838202015-01-07T13:17:41Z Impact of TSV induced thermo-mechanical stress on semiconductor device performance Lee, H.M. Liu, E.-X. Samudra, G.S. Li, E.-P. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EDAPS.2012.6469420 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 189-192 2014-10-07T04:45:33Z 2014-10-07T04:45:33Z 2012 Conference Paper Lee, H.M.,Liu, E.-X.,Samudra, G.S.,Li, E.-P. (2012). Impact of TSV induced thermo-mechanical stress on semiconductor device performance. 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 : 189-192. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EDAPS.2012.6469420" target="_blank">https://doi.org/10.1109/EDAPS.2012.6469420</a> 9781467314435 http://scholarbank.nus.edu.sg/handle/10635/83820 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 10.1109/EDAPS.2012.6469420
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Lee, H.M.
Liu, E.-X.
Samudra, G.S.
Li, E.-P.
format Conference or Workshop Item
author Lee, H.M.
Liu, E.-X.
Samudra, G.S.
Li, E.-P.
spellingShingle Lee, H.M.
Liu, E.-X.
Samudra, G.S.
Li, E.-P.
Impact of TSV induced thermo-mechanical stress on semiconductor device performance
author_sort Lee, H.M.
title Impact of TSV induced thermo-mechanical stress on semiconductor device performance
title_short Impact of TSV induced thermo-mechanical stress on semiconductor device performance
title_full Impact of TSV induced thermo-mechanical stress on semiconductor device performance
title_fullStr Impact of TSV induced thermo-mechanical stress on semiconductor device performance
title_full_unstemmed Impact of TSV induced thermo-mechanical stress on semiconductor device performance
title_sort impact of tsv induced thermo-mechanical stress on semiconductor device performance
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/83820
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