Impact of TSV induced thermo-mechanical stress on semiconductor device performance
10.1109/EDAPS.2012.6469420
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sg-nus-scholar.10635-838202015-01-07T13:17:41Z Impact of TSV induced thermo-mechanical stress on semiconductor device performance Lee, H.M. Liu, E.-X. Samudra, G.S. Li, E.-P. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EDAPS.2012.6469420 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 189-192 2014-10-07T04:45:33Z 2014-10-07T04:45:33Z 2012 Conference Paper Lee, H.M.,Liu, E.-X.,Samudra, G.S.,Li, E.-P. (2012). Impact of TSV induced thermo-mechanical stress on semiconductor device performance. 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 : 189-192. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EDAPS.2012.6469420" target="_blank">https://doi.org/10.1109/EDAPS.2012.6469420</a> 9781467314435 http://scholarbank.nus.edu.sg/handle/10635/83820 NOT_IN_WOS Scopus |
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10.1109/EDAPS.2012.6469420 |
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ELECTRICAL & COMPUTER ENGINEERING |
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ELECTRICAL & COMPUTER ENGINEERING Lee, H.M. Liu, E.-X. Samudra, G.S. Li, E.-P. |
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Conference or Workshop Item |
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Lee, H.M. Liu, E.-X. Samudra, G.S. Li, E.-P. |
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Lee, H.M. Liu, E.-X. Samudra, G.S. Li, E.-P. Impact of TSV induced thermo-mechanical stress on semiconductor device performance |
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Lee, H.M. |
title |
Impact of TSV induced thermo-mechanical stress on semiconductor device performance |
title_short |
Impact of TSV induced thermo-mechanical stress on semiconductor device performance |
title_full |
Impact of TSV induced thermo-mechanical stress on semiconductor device performance |
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Impact of TSV induced thermo-mechanical stress on semiconductor device performance |
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Impact of TSV induced thermo-mechanical stress on semiconductor device performance |
title_sort |
impact of tsv induced thermo-mechanical stress on semiconductor device performance |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/83820 |
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