Impact of TSV induced thermo-mechanical stress on semiconductor device performance
10.1109/EDAPS.2012.6469420
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Main Authors: | Lee, H.M., Liu, E.-X., Samudra, G.S., Li, E.-P. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83820 |
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Institution: | National University of Singapore |
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