Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators

10.1109/MEMSYS.2010.5442421

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Bibliographic Details
Main Authors: Xie, J., Lee, C., Wang, M.-F., Feng, H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84359
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-843592024-11-09T08:00:34Z Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators Xie, J. Lee, C. Wang, M.-F. Feng, H. ELECTRICAL & COMPUTER ENGINEERING 10.1109/MEMSYS.2010.5442421 Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 1175-1178 PMEME 2014-10-07T04:51:47Z 2014-10-07T04:51:47Z 2010 Conference Paper Xie, J.,Lee, C.,Wang, M.-F.,Feng, H. (2010). Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) : 1175-1178. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/MEMSYS.2010.5442421" target="_blank">https://doi.org/10.1109/MEMSYS.2010.5442421</a> 9781424457649 10846999 http://scholarbank.nus.edu.sg/handle/10635/84359 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/MEMSYS.2010.5442421
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Xie, J.
Lee, C.
Wang, M.-F.
Feng, H.
format Conference or Workshop Item
author Xie, J.
Lee, C.
Wang, M.-F.
Feng, H.
spellingShingle Xie, J.
Lee, C.
Wang, M.-F.
Feng, H.
Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
author_sort Xie, J.
title Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
title_short Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
title_full Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
title_fullStr Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
title_full_unstemmed Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
title_sort wafer-level vacuum sealing and encapsulation for fabrication of cmos mems thermoelectric power generators
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/84359
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