Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators

10.1109/MEMSYS.2010.5442421

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Bibliographic Details
Main Authors: Xie, J., Lee, C., Wang, M.-F., Feng, H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84359
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Institution: National University of Singapore