Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
10.1109/MEMSYS.2010.5442421
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Main Authors: | Xie, J., Lee, C., Wang, M.-F., Feng, H. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84359 |
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Institution: | National University of Singapore |
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