Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
Journal of the Mechanics and Physics of Solids
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2014
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الوصول للمادة أونلاين: | http://scholarbank.nus.edu.sg/handle/10635/84477 |
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sg-nus-scholar.10635-844772024-11-08T17:53:31Z Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion Zhang, Y.W. Bower, A.F. Xia, L. Shih, C.F. DEAN'S OFFICE (ENGINEERING) A. Diffusion A. Electromigration A. Surface B. Elastic material C. Finite elements Journal of the Mechanics and Physics of Solids 47 1 173-199 JMPSA 2014-10-07T05:24:48Z 2014-10-07T05:24:48Z 1998-12-04 Article Zhang, Y.W.,Bower, A.F.,Xia, L.,Shih, C.F. (1998-12-04). Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion. Journal of the Mechanics and Physics of Solids 47 (1) : 173-199. ScholarBank@NUS Repository. 00225096 http://scholarbank.nus.edu.sg/handle/10635/84477 NOT_IN_WOS Scopus |
institution |
National University of Singapore |
building |
NUS Library |
continent |
Asia |
country |
Singapore Singapore |
content_provider |
NUS Library |
collection |
ScholarBank@NUS |
topic |
A. Diffusion A. Electromigration A. Surface B. Elastic material C. Finite elements |
spellingShingle |
A. Diffusion A. Electromigration A. Surface B. Elastic material C. Finite elements Zhang, Y.W. Bower, A.F. Xia, L. Shih, C.F. Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
description |
Journal of the Mechanics and Physics of Solids |
author2 |
DEAN'S OFFICE (ENGINEERING) |
author_facet |
DEAN'S OFFICE (ENGINEERING) Zhang, Y.W. Bower, A.F. Xia, L. Shih, C.F. |
format |
Article |
author |
Zhang, Y.W. Bower, A.F. Xia, L. Shih, C.F. |
author_sort |
Zhang, Y.W. |
title |
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
title_short |
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
title_full |
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
title_fullStr |
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
title_full_unstemmed |
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
title_sort |
three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/84477 |
_version_ |
1821213304108875776 |