Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
Journal of the Mechanics and Physics of Solids
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| Main Authors: | , , , |
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| 格式: | Article |
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2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/84477 |
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| 機構: | National University of Singapore |