Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Journal of the Mechanics and Physics of Solids

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Main Authors: Zhang, Y.W., Bower, A.F., Xia, L., Shih, C.F.
其他作者: DEAN'S OFFICE (ENGINEERING)
格式: Article
出版: 2014
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在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/84477
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spelling sg-nus-scholar.10635-844772024-11-08T17:53:31Z Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion Zhang, Y.W. Bower, A.F. Xia, L. Shih, C.F. DEAN'S OFFICE (ENGINEERING) A. Diffusion A. Electromigration A. Surface B. Elastic material C. Finite elements Journal of the Mechanics and Physics of Solids 47 1 173-199 JMPSA 2014-10-07T05:24:48Z 2014-10-07T05:24:48Z 1998-12-04 Article Zhang, Y.W.,Bower, A.F.,Xia, L.,Shih, C.F. (1998-12-04). Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion. Journal of the Mechanics and Physics of Solids 47 (1) : 173-199. ScholarBank@NUS Repository. 00225096 http://scholarbank.nus.edu.sg/handle/10635/84477 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic A. Diffusion
A. Electromigration
A. Surface
B. Elastic material
C. Finite elements
spellingShingle A. Diffusion
A. Electromigration
A. Surface
B. Elastic material
C. Finite elements
Zhang, Y.W.
Bower, A.F.
Xia, L.
Shih, C.F.
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
description Journal of the Mechanics and Physics of Solids
author2 DEAN'S OFFICE (ENGINEERING)
author_facet DEAN'S OFFICE (ENGINEERING)
Zhang, Y.W.
Bower, A.F.
Xia, L.
Shih, C.F.
format Article
author Zhang, Y.W.
Bower, A.F.
Xia, L.
Shih, C.F.
author_sort Zhang, Y.W.
title Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
title_short Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
title_full Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
title_fullStr Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
title_full_unstemmed Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
title_sort three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/84477
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