A new accurate closed-form analytical solution for junction temperature of high-powered devices

10.1115/1.4026352

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Bibliographic Details
Main Authors: Ling, J.H.L., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84794
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Institution: National University of Singapore
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Summary:10.1115/1.4026352