A new accurate closed-form analytical solution for junction temperature of high-powered devices
10.1115/1.4026352
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Main Authors: | Ling, J.H.L., Tay, A.A.O. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84794 |
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Institution: | National University of Singapore |
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