A new accurate closed-form analytical solution for junction temperature of high-powered devices
10.1115/1.4026352
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sg-nus-scholar.10635-847942023-10-26T10:13:03Z A new accurate closed-form analytical solution for junction temperature of high-powered devices Ling, J.H.L. Tay, A.A.O. MECHANICAL ENGINEERING 10.1115/1.4026352 Journal of Electronic Packaging, Transactions of the ASME 136 1 - JEPAE 2014-10-07T09:00:23Z 2014-10-07T09:00:23Z 2014-03 Article Ling, J.H.L., Tay, A.A.O. (2014-03). A new accurate closed-form analytical solution for junction temperature of high-powered devices. Journal of Electronic Packaging, Transactions of the ASME 136 (1) : -. ScholarBank@NUS Repository. https://doi.org/10.1115/1.4026352 10437398 http://scholarbank.nus.edu.sg/handle/10635/84794 000331834300007 Scopus |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Ling, J.H.L. Tay, A.A.O. |
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Ling, J.H.L. Tay, A.A.O. |
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Ling, J.H.L. Tay, A.A.O. A new accurate closed-form analytical solution for junction temperature of high-powered devices |
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Ling, J.H.L. |
title |
A new accurate closed-form analytical solution for junction temperature of high-powered devices |
title_short |
A new accurate closed-form analytical solution for junction temperature of high-powered devices |
title_full |
A new accurate closed-form analytical solution for junction temperature of high-powered devices |
title_fullStr |
A new accurate closed-form analytical solution for junction temperature of high-powered devices |
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A new accurate closed-form analytical solution for junction temperature of high-powered devices |
title_sort |
new accurate closed-form analytical solution for junction temperature of high-powered devices |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/84794 |
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