A new accurate closed-form analytical solution for junction temperature of high-powered devices

10.1115/1.4026352

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Bibliographic Details
Main Authors: Ling, J.H.L., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84794
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-847942023-10-26T10:13:03Z A new accurate closed-form analytical solution for junction temperature of high-powered devices Ling, J.H.L. Tay, A.A.O. MECHANICAL ENGINEERING 10.1115/1.4026352 Journal of Electronic Packaging, Transactions of the ASME 136 1 - JEPAE 2014-10-07T09:00:23Z 2014-10-07T09:00:23Z 2014-03 Article Ling, J.H.L., Tay, A.A.O. (2014-03). A new accurate closed-form analytical solution for junction temperature of high-powered devices. Journal of Electronic Packaging, Transactions of the ASME 136 (1) : -. ScholarBank@NUS Repository. https://doi.org/10.1115/1.4026352 10437398 http://scholarbank.nus.edu.sg/handle/10635/84794 000331834300007 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1115/1.4026352
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Ling, J.H.L.
Tay, A.A.O.
format Article
author Ling, J.H.L.
Tay, A.A.O.
spellingShingle Ling, J.H.L.
Tay, A.A.O.
A new accurate closed-form analytical solution for junction temperature of high-powered devices
author_sort Ling, J.H.L.
title A new accurate closed-form analytical solution for junction temperature of high-powered devices
title_short A new accurate closed-form analytical solution for junction temperature of high-powered devices
title_full A new accurate closed-form analytical solution for junction temperature of high-powered devices
title_fullStr A new accurate closed-form analytical solution for junction temperature of high-powered devices
title_full_unstemmed A new accurate closed-form analytical solution for junction temperature of high-powered devices
title_sort new accurate closed-form analytical solution for junction temperature of high-powered devices
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/84794
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