Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications

Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications

10.1088/0960-1317/16/4/025

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Bibliographic Details
Main Authors: Iliescu, C., Tay, F.E.H., Wei, J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85365
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/85365

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