Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications

10.1088/0960-1317/16/4/025

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Main Authors:	Iliescu, C., Tay, F.E.H., Wei, J.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85365
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85365
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spelling	sg-nus-scholar.10635-853652023-10-30T20:26:37Z Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications Iliescu, C. Tay, F.E.H. Wei, J. MECHANICAL ENGINEERING 10.1088/0960-1317/16/4/025 Journal of Micromechanics and Microengineering 16 4 869-874 JMMIE 2014-10-07T09:07:09Z 2014-10-07T09:07:09Z 2006-04-01 Article Iliescu, C., Tay, F.E.H., Wei, J. (2006-04-01). Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications. Journal of Micromechanics and Microengineering 16 (4) : 869-874. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/16/4/025 09601317 http://scholarbank.nus.edu.sg/handle/10635/85365 000237312600026 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1088/0960-1317/16/4/025
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Iliescu, C. Tay, F.E.H. Wei, J.
format	Article
author	Iliescu, C. Tay, F.E.H. Wei, J.
spellingShingle	Iliescu, C. Tay, F.E.H. Wei, J. Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications
author_sort	Iliescu, C.
title	Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications
title_short	Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications
title_full	Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications
title_fullStr	Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications
title_full_unstemmed	Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications
title_sort	low stress pecvd - sinx layers at high deposition rates using high power and high frequency for mems applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85365
_version_	1781784656278978560

Low stress PECVD - SiNx layers at high deposition rates using high power and high frequency for MEMS applications

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