Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP

Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP

10.1016/j.microrel.2010.01.043

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Bibliographic Details
Main Authors: Su, Y.A., Tan, L.B., Tee, T.Y., Tan, V.B.C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85591
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Institution: National University of Singapore
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Summary:10.1016/j.microrel.2010.01.043

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